Development and applications of packaging materials for power semiconductor devices
ID:141 View Protection:ATTENDEE Updated Time:2021-08-19 19:29:48 Hits:321 Invited speech

Start Time:2021-08-26 11:10 (Asia/Shanghai)

Duration:40min

Session:[K] Plenary Session [K1] Plenary Session 1

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Abstract
Development and applications of packaging materials for power semiconductor devices
Keywords
Speaker
Mingxiang Chen
Huazhong University of Science and Technology (HUST)

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