Development and applications of packaging materials for power semiconductor devices
ID：141
View Protection：ATTENDEE
Updated Time：2021-08-19 19:29:48
Hits：826
Invited speech
Start Time：2021-08-26 11:10 （Asia/Shanghai）
Duration：40min
Session：[K] Plenary Session » [K1] Plenary Session 1
No files
Abstract
Development and applications of packaging materials for power semiconductor devices
Keywords
Speaker
Comment submit