[157]Tutorial 8: Design Advances in High Frequency Power Converters with Wide Bandgap Devices ---Part 2 Magnetics
Zhe Zhang Technical University of Denmark;Bainan Sun Infineon Technologies;Hongbo Zhao Aalborg University;Zhan Shen Aalborg University
T2 /T2 25 Aug 2021, 17:00-18:00
ATTENDEE Tutorial
[156]Design Advances in High Frequency Power Converters with Wide Bandgap Devices ---Part1 Power Loop Impedance Control
Zhe Zhang Technical University of Denmark;Bainan Sun Infineon Technologies;Hongbo Zhao Aalborg University;Zhan Shen Aalborg University
T2 /T2 25 Aug 2021, 16:00-17:00
ATTENDEE Tutorial
[155]Thermal Design and Optimization of SiC Power Module
Zhiqiang Wang Huazhong University of Science and Technology;Tong Wu ON Semiconductor
T2 /T2 25 Aug 2021, 14:30-15:30
ATTENDEE Tutorial
[154]Resonant Gate Drivers For SiC Devices In High Frequency, High Power Density Applications
Han Peng Huazhong University of Science and Technology
T2 /T2 25 Aug 2021, 13:30-14:30
ATTENDEE Tutorial
[153]Advanced Packaging Technologies for Silicon Carbide Devices and Their Reliability Issues
Nan Jiang Hefei Comprehensive National Science Center
T1 /T1 25 Aug 2021, 17:00-18:00
ATTENDEE Tutorial
[152]Sintered-Silver Bonding (SSB) for Power Packaging: Its Science and Practice
Yunhui Mei Tianjin Polytechnic University
T1 /T1 25 Aug 2021, 16:00-17:00
ATTENDEE Tutorial
[150]Multi-MHz Power Conversion Technology Based on GaN Devices
Guan Yueshi Harbin Institue of Technology;Yijie Wang Harbin Institute of Technology;Dianguo Xu Harbin Institute of Technology
T1 /T1 25 Aug 2021, 13:30-14:30
ATTENDEE Tutorial
[148]Effects of p-type Islands Configuration on the Electrical Characteristics of the 4H-SiC Trench MOSFETs with Integrated Schottky Barrier Diode
zhanwei shen Institute of Semiconductors, Chinese Academy of Sciences
P /P1 27 Aug 2021, 12:50-12:55
PUBLIC Poster Presentation
[142]Influence of CucorAl wire bonding on reliability of SiC devices
Fang Chao engineer Zhuzhou CRRC Times Semiconductor Co., Ltd.
PUBLIC Poster Presentation
[141]Development and applications of packaging materials for power semiconductor devices
Mingxiang Chen Huazhong University of Science and Technology (HUST)
K /K1 26 Aug 2021, 11:10-11:50
ATTENDEE Invited speech
[137]Evaluating Switching Performance of GaN HEMT Using Analytical Modeling
Yingzhe Wu University of Electronic Science and Technology of China
PUBLIC Poster Presentation
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