Advanced Packaging Technologies for Silicon Carbide Devices and Their Reliability Issues
ID:153 View Protection:ATTENDEE Updated Time:2021-08-30 13:38:02 Hits:232 Tutorial

Start Time:2021-08-25 17:00 (Asia/Shanghai)

Duration:60min

Session:[T1] Tutorial Session 1 [T1] Tutorial Session 1

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Abstract
Advanced Packaging Technologies for Silicon Carbide Devices and Their Reliability Issues
Keywords
Speaker
Nan Jiang
Hefei Comprehensive National Science Center

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