Video playback - IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WIPDA-ASIA 2021)

Room1 Oral Session 1 » S3&S4 WBG Device Applications, Package Design & Analysis

2021-08-27 14:00 ~ 17:30 (Asia/Shanghai)

ZOOM Conference / WIPDA-Asia 2021 ROOM 1

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Timetable

WBG Device Applications

Chair: Xuehua Wang, Huazhong University of Science and Technology / Haoze Luo, Zhejiang University

08-27

14:00~14:15

A Predictive Method for Switching Time of Nanosecond Pulsed Power System of Ohmic Loads Using SiC MOSFETs

Xin Li，Naval University of Engineering

08-27

14:15~14:30

Analysis of an Output Series High Voltage Gain Impedance Source Circuit Based on SiC Switch

Qing Cheng，China；School of Electrical Engineering and Automation； Harbin Institute of Technology； Harbin

08-27

14:30~14:45

Homogeneous-Flux Transmitter Coil Design with Improved Position Tolerance

Yunfeng Liu，Department of Electrical Engineering； Technical University of Denmark

08-27

14:45~15:00

An Accurate Analytical Model for Motor Terminal Overvoltage Prediction and Mitigation in SiC Motor Drives

Neng Wang，Huazhong University of Science and Technology

08-27

15:00~15:15

Adaptive Digital Technique Assisted Hard Switching Fault Detection for SiC MOSFETs

Saravanan Dhanasekaran，Indian Institute of Technology Madras

08-27

15:15~15:30

Coffee Break

WBG Device Package Design & Analysis

Chair: Jianing Wang, Hefei University of Technology / Cai Chen, Huazhong University of Science and Technology

08-27

15:30~15:45

Comparison Study of Parasitic Inductance, Capacitance and Thermal Resistance for Various SiC Packaging Structures

Yifan Zhang，Huazhong University of Science and Technology

08-27

15:45~16:00

A Layout Optimization Method to Reduce Commutation Inductance of Multi-Chip Power Module Based on Genetic Algorithm

Yu Zhou，Zhejiang University

08-27

16:00~16:15

A High Power Density Chip-on-Chip Gan-based Module with Ultra-Low Parasitic Inductance

Yi Zhang，Huazhong University of Science and Technology；State Key Laboratory of Advanced Electromagnetic Engineering and Technology

08-27

16:15~16:30

15kV Press Pack SiC IGBT

yujie du，；Global Energy Interconnection Research Institute Co.；ltd

08-27

16:30~16:45

Analysis of Dynamic Current Balancing in Multichip SiC Power Modules Based on Coupled Parasitic Network Model

Yuxin Ge，Huazhong University of Science and Technology

08-27

16:45~17:00

Power Loop Inductance Extraction with High Order Polynomial Fitting Algorithm for SiC MOSFET Power Module Characterization

Zhikun Wang，Fudan University

IEEE Workshop on Wide Bandgap Power Devices
and Applications in Asia (WiPDA Asia 2021)

A Predictive Method for Switching Time of Nanosecond Pulsed Power System of Ohmic Loads Using SiC MOSFETs

Analysis of an Output Series High Voltage Gain Impedance Source Circuit Based on SiC Switch

Homogeneous-Flux Transmitter Coil Design with Improved Position Tolerance

An Accurate Analytical Model for Motor Terminal Overvoltage Prediction and Mitigation in SiC Motor Drives

Adaptive Digital Technique Assisted Hard Switching Fault Detection for SiC MOSFETs

Comparison Study of Parasitic Inductance, Capacitance and Thermal Resistance for Various SiC Packaging Structures

A Layout Optimization Method to Reduce Commutation Inductance of Multi-Chip Power Module Based on Genetic Algorithm

A High Power Density Chip-on-Chip Gan-based Module with Ultra-Low Parasitic Inductance

15kV Press Pack SiC IGBT

Analysis of Dynamic Current Balancing in Multichip SiC Power Modules Based on Coupled Parasitic Network Model

Power Loop Inductance Extraction with High Order Polynomial Fitting Algorithm for SiC MOSFET Power Module Characterization

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IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia 2021)

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IEEE Workshop on Wide Bandgap Power Devices
and Applications in Asia (WiPDA Asia 2021)