Tutorial 8: Design Advances in High Frequency Power Converters with Wide Bandgap Devices ---Part 2 Magnetics
Zhe Zhang Technical University of Denmark;Bainan Sun Infineon Technologies;Hongbo Zhao Aalborg University;Zhan Shen Aalborg University
T2 /T2 2021-08-25 17:00 ~ 18:00
ATTENDEE Tutorial
Design Advances in High Frequency Power Converters with Wide Bandgap Devices ---Part1 Power Loop Impedance Control
Zhe Zhang Technical University of Denmark;Bainan Sun Infineon Technologies;Hongbo Zhao Aalborg University;Zhan Shen Aalborg University
T2 /T2 2021-08-25 16:00 ~ 17:00
ATTENDEE Tutorial
Thermal Design and Optimization of SiC Power Module
Zhiqiang Wang Huazhong University of Science and Technology;Tong Wu ON Semiconductor
T2 /T2 2021-08-25 14:30 ~ 15:30
ATTENDEE Tutorial
Resonant Gate Drivers For SiC Devices In High Frequency, High Power Density Applications
Han Peng Huazhong University of Science and Technology
T2 /T2 2021-08-25 13:30 ~ 14:30
ATTENDEE Tutorial
Advanced Packaging Technologies for Silicon Carbide Devices and Their Reliability Issues
Nan Jiang Hefei Comprehensive National Science Center
T1 /T1 2021-08-25 17:00 ~ 18:00
ATTENDEE Tutorial
Sintered-Silver Bonding (SSB) for Power Packaging: Its Science and Practice
Yunhui Mei Tianjin Polytechnic University
T1 /T1 2021-08-25 16:00 ~ 17:00
ATTENDEE Tutorial
High Frequency Power Conversion with SiC Power Devices for The High Voltage Power Supply with Fast Transient Response
Saijun Mao Fudan University
T1 /T1 2021-08-25 14:30 ~ 15:30
ATTENDEE Tutorial
Multi-MHz Power Conversion Technology Based on GaN Devices
Guan Yueshi Harbin Institue of Technology;Yijie Wang Harbin Institute of Technology;Dianguo Xu Harbin Institute of Technology
T1 /T1 2021-08-25 13:30 ~ 14:30
ATTENDEE Tutorial
Investigation on Parameter Extraction for An Improved Fourier-Series-Based NPT IGBT Model
Yifei Ding Hunan University
Pending
PUBLIC Poster Presentation
Effects of p-type Islands Configuration on the Electrical Characteristics of the 4H-SiC Trench MOSFETs with Integrated Schottky Barrier Diode
zhanwei shen Institute of Semiconductors, Chinese Academy of Sciences
P /P1 2021-08-27 12:50 ~ 12:55
PUBLIC Poster Presentation
Influence of CucorAl wire bonding on reliability of SiC devices
Fang Chao engineer Zhuzhou CRRC Times Semiconductor Co., Ltd.
Pending
PUBLIC Poster Presentation
Development and applications of packaging materials for power semiconductor devices
Mingxiang Chen Huazhong University of Science and Technology (HUST)
K /K1 2021-08-26 11:10 ~ 11:50
ATTENDEE Invited speech
Evaluating Switching Performance of GaN HEMT Using Analytical Modeling
Yingzhe Wu University of Electronic Science and Technology of China
Pending
PUBLIC Poster Presentation
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